Materials, structures, and methods for optical and electrical iii-nitride semiconductor devices

ABSTRACT

The present invention provides materials, structures, and methods for III-nitride-based devices, including epitaxial and non-epitaxial structures useful for III-nitride devices including light emitting devices, laser diodes, transistors, detectors, sensors, and the like. In some embodiments, the present invention provides metallo-semiconductor and/or metallo-dielectric devices, structures, materials and methods of forming metallo-semiconductor and/or metallo-dielectric material structures for use in semiconductor devices, and more particularly for use in III-nitride based semiconductor devices. In some embodiments, the present invention includes materials, structures, and methods for improving the crystal quality of epitaxial materials grown on non-native substrates. In some embodiments, the present invention provides materials, structures, devices, and methods for acoustic wave devices and technology, including epitaxial and non-epitaxial piezoelectric materials and structures useful for acoustic wave devices. In some embodiments, the present invention provides metal-base transistor devices, structures, materials and methods of forming metal-base transistor material structures for use in semiconductor devices.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a national-phase filing of, and claims prioritybenefit of, PCT Patent Application No. PCT/US2013/031800, filed Mar. 14,2013 and titled “MATERIALS, STRUCTURES, AND METHODS FOR OPTICAL ANDELECTRICAL III-NITRIDE SEMICONDUCTOR DEVICES,” which claims prioritybenefit of:

U.S. Provisional Patent Application No. 61/610,943, titled“METALLO-SEMICONDUCTOR STRUCTURES FOR III-NITRIDE DEVICES” filed Mar.14, 2012;

U.S. Provisional Patent Application No. 61/623,885, titled “STRUCTURESFOR III-NITRIDE DEVICES” filed Apr. 13, 2012; and

U.S. Provisional Patent Application No. 61/655,477, titled “METAL-BASETRANSISTORS FOR III-NITRIDE DEVICES” filed Jun. 4, 2012; each of whichis incorporated herein by reference in its entirety.

This is related to prior:

U.S. Provisional Patent Application No. 60/835,934, titled “III-NITRIDELIGHT-EMITTING DEVICES WITH ONE OR MORE RESONANCE REFLECTORS ANDREFLECTIVE ENGINEERED GROWTH TEMPLATES FOR SUCH DEVICES, AND METHODS”filed Aug. 6, 2006;

U.S. Provisional Patent Application No. 60/821,588, titled “III-NITRIDELIGHT-EMITTING DEVICES WITH ONE OR MORE RESONANCE REFLECTORS ANDREFLECTIVE ENGINEERED GROWTH TEMPLATES FOR SUCH DEVICES, AND METHODS”filed Aug. 7, 2006;

U.S. Provisional Patent Application No. 61/066,960, titled“CURRENT-INJECTING/TUNNELING LIGHT EMITTING DEVICE AND METHOD” filedFeb. 25, 2008;

U.S. Provisional Patent Application No. 61/068,299, titled “LIFTOFFMETHOD, RESULTING MATERIALS AND DEVICES” filed Mar. 5, 2008;

U.S. Provisional Patent Application No. 61/125,367, titled “EngineeredSubstrates” filed Apr. 24, 2008;

U.S. Provisional Patent Application No. 61/384,401, titled “III-NITRIDEALTERNATING-CURRENT LIGHT-EMITTING DEVICE AND METHOD” filed Sep. 20,2010;

U.S. Provisional Patent Application No. 61/394,725, titled “III-NITRIDEDEVICE AND METHOD” filed Oct. 19, 2010;

U.S. Provisional Patent Application No. 61/445,595, titled “III-NITRIDEDEVICE, MATERIALS AND METHOD” filed Feb. 23, 2011;

U.S. patent application Ser. No. 11/882,730, now U.S. Pat. No. 7,915,624filed Sep. 3, 2007, titled “III-NITRIDE LIGHT-EMITTING DEVICES WITH ONEOR MORE RESONANCE REFLECTORS AND REFLECTIVE ENGINEERED GROWTH TEMPLATESFOR SUCH DEVICES, AND METHODS”;

U.S. patent application Ser. No. 13/075,104, now U.S. Pat. No. 8,253,157(a divisional of U.S. Pat. No. 7,915,624) filed Mar. 29, 2011, titled“III-NITRIDE LIGHT-EMITTING DEVICES WITH REFLECTIVE ENGINEERED GROWTHTEMPLATES AND METHODS OF MANUFACTURE”;

U.S. patent application Ser. No. 13/597,130 (a divisional of U.S. Pat.No. 8,253,157) filed Aug. 28, 2012, titled “III-NITRIDE LIGHT-EMITTINGDEVICES WITH REFLECTIVE ENGINEERED GROWTH TEMPLATES AND MANUFACTURINGMETHOD”;

U.S. patent application Ser. No. 12/393,029, now U.S. Pat. No. 7,842,939filed Feb. 25, 2009, titled “CURRENT-INJECTING/TUNNELING LIGHT-EMITTINGDEVICE AND METHOD”;

U.S. patent application Ser. No. 12/956,640, (a divisional of U.S. Pat.No. 7,842,939) filed Nov. 30, 2010, titled “METHOD OF FORMINGCURRENT-INJECTING/TUNNELING LIGHT-EMITTING DEVICE”;

U.S. patent application Ser. No. 13/237,914, titled “III-NITRIDEALTERNATING-CURRENT LIGHT-EMITTING DEVICE AND METHOD” filed Sep. 20,2011; and

U.S. patent application Ser. No. 13/656,660, titled “III-NITRIDEINTEGRATED CIRCUITS, ELEMENTS, AND METHOD” filed Oct. 19, 2012; each ofwhich is incorporated herein by reference in its entirety.

There are multiple embodiments described herein, each of which can becombined with one or more other embodiments described herein and/orincorporated by reference.

FIELD OF THE INVENTION

The present invention relates to the field of semiconductor devices andmethods of manufacturing semiconductor devices, and more specifically tomaterials, structures, and methods for optical and electricalIII-nitride-based semiconductor devices, some embodiments of whichprovide epitaxially grown metal-containing layers, electricallyinsulating layers, highly electrically conductive layers, highlyoptically transmissive layers, highly optically reflective layers,n-type semiconductors, p-type semiconductors, i-type (intrinsic)semiconductors, metallo-semiconductor structures, metallo-dielectricstructures, and combinations of one or more of the above layers.

BACKGROUND OF THE INVENTION

Gallium nitride (GaN), a wide bandgap semiconductor, has receivedsignificant interest and investment from educational, governmental, andindustrial entities due to the potential for fabricating advancedoptical and electrical GaN-based semiconductor devices. Beginning in theearly 1990's, researchers have made continuous progress in researchingdeveloping, improving, and ultimately commercializing GaN-basedsemiconductor devices, including green and blue wavelength lightemitting diodes (LEDs), blue wavelength laser diodes (LDs), andhigh-speed and high-power metal-semiconductor field effect transistors(MESFETs), high-electron mobility transistors (HEMTs), and powertransistors.

While significant progress has been made in the development of Group-IIInitride (hereafter, “III-nitride”)-based semiconductor devices, furtherimprovements in device materials, structures, and methods of fabricationare needed to realize the full potential, in terms of deviceperformance, efficiency, and cost metrics, of III-nitride-based devices.Therefore, there is an unmet need in the industry for materials,structures, and methods for improving the performance, efficiency, andcost of III-nitride-based semiconductor devices. In addition, there is afurther unmet need in the industry for a so-called metal-basetransistor, which has been commercially unavailable do to the difficultyin forming high-quality semiconductor/metal/semiconductor epitaxialstructures.

SUMMARY OF THE INVENTION

The present invention provides metallo-semiconductor structurescomprising a substrate having a top surface and a bottom surface; andone or more periods of a metallo-semiconductor on the top surface of thesubstrate, wherein each of the one or more periods includes a firstlayer and a second layer, wherein the first layer is a metal and thesecond layer is a semiconductor, and wherein the first layer issubstantially lattice matched to the second layer.

In some embodiments, the present invention providesmetallo-semiconductor and/or metallo-dielectric devices, structures,materials and methods of forming metallo-semiconductor and/ormetallo-dielectric material structures for use in semiconductor devices,and more particularly for use in III-nitride based semiconductordevices. In some embodiments, the present invention includes materials,structures, and methods for improving the crystal quality of epitaxialmaterials grown on non-native substrates. In some embodiments, thepresent invention provides materials, structures, devices, and methodsfor acoustic wave devices and technology, including epitaxial andnon-epitaxial piezoelectric materials and structures useful for acousticwave devices. In some embodiments, the present invention providesmetal-base transistor devices, structures, materials and methods offorming metal-base transistor material structures for use insemiconductor devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a block diagram of a two-layer metallo-semiconductorstructure 101, according to some embodiments of the present invention.

FIG. 1B is a block diagram of a multi-layer metallo-semiconductorstructure 102, according to some embodiments of the present invention.

FIG. 1C is a block diagram of a multi-layer metallo-semiconductorstructure 103, according to some embodiments of the present invention.

FIG. 2A is a plot 201 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of the HfNlayer thickness, according to some embodiments of the present invention.

FIG. 2B is a plot 202 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of GaN layerthickness, according to some embodiments of the present invention.

FIG. 2C is a plot 203 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of incidentangle from normal, according to some embodiments of the presentinvention.

FIG. 2D is a plot 204 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of the numberof periods in the metallo-semiconductor structure, according to someembodiments of the present invention.

FIG. 2E is a plot 205 showing simulated and actual reflectivity data fora four-period metallo-semiconductor structure, according to someembodiments of the present invention.

FIG. 2F is a plot 206 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of the numberof periods of the HfN/AlN layer structure, according to some embodimentsof the present invention.

FIG. 2G is a plot 207 showing measured reflectivity curves for amulti-layer metallo-semiconductor structure as a function of theincident wavelength of light, according to some embodiments of thepresent invention.

FIG. 2H is a plot 208 showing a measured reflectivity curve for a bulkHfN mirror and for a multi-layer metallo-semiconductor structure as afunction of the incident wavelength of light, according to someembodiments of the present invention.

FIG. 3 is a block diagram of semiconductor device structure 301 thatincludes a multi-layer metallo-semiconductor structure, according tosome embodiments of the present invention.

FIG. 4A is a perspective drawing of LED 401 that includes a multi-layermetallo-semiconductor structure, according to some embodiments of thepresent invention.

FIG. 4B is a perspective drawing of LED 402 that includes a multi-layermetallo-semiconductor structure, according to some embodiments of thepresent invention.

FIG. 4C is a perspective drawing of a LED 403 that includes amulti-layer metallo-semiconductor structure, according to someembodiments of the present invention.

FIG. 5 is a block diagram of LED 501 that includes a multi-layermetallo-semiconductor structure in combination with a thick bulkmetallic layer, according to some embodiments of the present invention.

FIG. 6 is a block diagram of optically pumped semiconductor devicestructure 601 that includes a plurality of multi-layermetallo-semiconductor structures in combination with a plurality ofquantum well regions, according to some embodiments of the presentinvention.

FIG. 7 is a block diagram of III-nitride substrate structure 701 thatincludes a sacrificial metallic layer, according to some embodiments ofthe present invention.

FIG. 8A is a block diagram of III-nitride growth template 801 thatincludes a 2-dimensional (2D) photonic-crystal (PhC) GEMM layer,according to some embodiments of the present invention.

FIG. 8B is a perspective drawing of 2D PhC-GEMM layer 802, according tosome embodiments of the present invention.

FIG. 8C is a perspective drawing of III-nitride growth template 803 thatincludes a 3-dimensional (3D) PhC-GEMM structure, according to someembodiments of the present invention.

FIG. 8D is an exploded perspective drawing of 3D PhC-GEMM structure 804,according to some embodiments of the present invention, according tosome embodiments of the present invention.

FIG. 9 is a block diagram of III-nitride tandem reflector growthtemplate 901 that includes a plurality of 1D PhC-GEMM structures,according to some embodiments of the present invention.

FIG. 10 is a perspective drawing of vertical-cavity surface-emittinglaser (VCSEL) 1001 that includes a plurality of 1D PhC-GEMM structures,according to some embodiments of the present invention.

FIG. 11 is a block diagram of engineered light exiting surface 1101,according to some embodiments of the present invention.

FIG. 12 is a block diagram of III-nitride dislocation filter growthtemplate 1301, according to some embodiments of the present invention.

FIG. 13 is a cross-sectional TEM image of III-nitride dislocation filtergrowth template 1302, according to some embodiments of the presentinvention.

FIG. 14A is a block diagram of metal base transistor structure 1501.1and corresponding energy diagram 1501.2, according to some embodimentsof the present invention.

FIG. 14B is a block diagram of metal base transistor structure 1502.1and corresponding energy diagram 1502.2, according to some embodimentsof the present invention.

FIG. 14C is a block diagram of metal base transistor structure 1503.1and corresponding energy diagram 1503.2, according to some embodimentsof the present invention.

FIG. 14D is a block diagram of metal base transistor structure 1504.1and corresponding energy diagram 1504.2, according to some embodimentsof the present invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

Although the following detailed description contains many specifics forthe purpose of illustration, a person of ordinary skill in the art willappreciate that many variations and alterations to the following detailsare within the scope of the invention. Very narrow and specific examplesare used to illustrate particular embodiments; however, the inventiondescribed in the claims is not intended to be limited to only theseexamples, but rather includes the full scope of the attached claims.Accordingly, the following preferred embodiments of the invention areset forth without any loss of generality to, and without imposinglimitations upon the claimed invention. Further, in the followingdetailed description of the preferred embodiments, reference is made tothe accompanying drawings that form a part hereof, and in which areshown by way of illustration specific embodiments in which the inventionmay be practiced. It is understood that other embodiments may beutilized and structural changes may be made without departing from thescope of the present invention. The embodiments shown in the Figures anddescribed here may include features that are not included in allspecific embodiments. A particular embodiment may include only a subsetof all of the features described, or a particular embodiment may includeall of the features described.

The leading digit(s) of reference numbers appearing in the Figuresgenerally corresponds to the Figure number in which that component isfirst introduced, such that the same reference number is used throughoutto refer to an identical component which appears in multiple Figures.Signals and connections may be referred to by the same reference numberor label, and the actual meaning will be clear from its use in thecontext of the description.

In some embodiments, the present invention provides materials,structures, and methods for III-nitride-based devices, includingepitaxial and non-epitaxial structures useful for III-nitride devicesincluding light emitting devices, laser diodes, transistors, detectors,sensors, and the like.

In some embodiments, the present invention providesmetallo-semiconductor and/or metallo-dielectric devices, structures,materials and methods of forming metallo-semiconductor and/ormetallo-dielectric material structures for use in semiconductor devices,and more particularly for use in III-nitride based semiconductordevices.

Specifically, in some embodiments, the present invention providesdevices, structures, and materials that include combinations of one ormore layers of metallic materials and one or more layers ofsemiconductor materials, dielectric materials, and/or combinations ofsemiconductor and dielectric materials, and methods of forming suchdevices, structures, and materials. In some embodiments, the one or moremetallic layers and the one or more semiconductor and/or dielectriclayers are epitaxial.

As used herein, the term “epitaxial” refers to a material state (i.e.,not a process) of inorganic materials based on the materials' electricalor electrical and optical relationship with other inorganic materialsthat it is physically in contact with (typically layered), such that thematerials are substantially lattice matched (i.e., the atomic latticesof the two or more materials line up in a predictable and organizedrepeating atomic lattice structure) and that the materials aresubstantially single crystal (i.e., the strain of the lattice mismatchand layer thickness, 1) does not generate undesired cracking within thedevice, 2) does not generate dislocations with densities large enoughand/or of the type to result in undesired electrical shorting of thedevice such that the device can not be useful, and 3) does not generatea secondary material phase (e.g., inclusions, precipitates, poly-crystalgrains, and/or multi crystal grains) such that the device is notuseful).

In addition, as one of skill in the art would understand,carbon-containing compounds, such as carbides, carbonates, simple oxidesof carbon (e.g., CO and CO₂), and cyanides, as well as the allotropes ofcarbon (e.g., diamond and graphite), are considered to be inorganicmaterials.

In some embodiments, the present invention provides a plurality ofalternating layers of epitaxial metal and semiconductor materials toform epitaxial metallo-semiconductor devices, structures, and materialsand methods of forming such epitaxial metallo-semiconductor devices,structures, materials, such that the metal layers and semiconductorlayers are substantially lattice matched. In some embodiments, thepresent invention provides a plurality of alternating layers ofepitaxial metal and dielectric materials to form epitaxialmetallo-dielectric devices, structures, and materials and methods offorming such epitaxial metallo-dielectric devices, structures,materials, such that the metal layers and dielectric layers aresubstantially lattice matched. In some embodiments, the presentinvention provides a plurality of alternating layers of epitaxial metal,semiconductor, and dielectric materials to form epitaxialmetallo-semiconductor-dielectric devices, structures, and materials andmethods of forming such epitaxial metallo-semiconductor-dielectricdevices, structures, materials, such that the metal layers anddielectric layers are substantially lattice matched.

As used herein, the term “period” refers to a set of alternatingmaterial layers, wherein each material layer is adjacent to the nextmaterial layer. For example, in some embodiments, for ametallo-semiconductor structure that includes two unique material layers(e.g., alternating layers of HfN and GaN), each set of HfN—GaN layers isreferred to as a period. In such an example, if there were twenty (20)total layers alternating between HfN and GaN, the structure wouldinclude ten (10) periods of HfN—GaN. In another example, if there weretwenty (20) total layers alternating between HfN and AlN, the structurewould include ten (10) periods of HfN—AlN. In yet another example, ifthere were twenty (20) total layers alternating between HfN andcompounds made of AlN, GaN and/or InN while being intentionally doped ornot doped, the structure would include ten (10) periods of HfN-compoundsmade of AlN, GaN and/or InN while being intentionally doped or notdoped. As another example, in some embodiments, for ametallo-semiconductor structure that includes three unique materiallayers (e.g., alternating layers of HfN, GaN, and AlN), each set ofHfN—GaN—AlN layers is referred to as a period. In this additionalexample, if there were twenty-one (21) total layers alternating betweenHfN, GaN, and AlN, the structure would include seven (7) periods ofHfN—GaN—AlN. As another example, in some embodiments, for ametallo-semiconductor structure that includes three unique materiallayers (e.g., alternating layers of HfN, AlN, and GaN), each set ofHfN—AlN—GaN layers is referred to as a period. In this additionalexample, if there were twenty-one (21) total layers alternating betweenHfN, AlN, and GaN, the structure would include seven (7) periods ofHfN—AlN—GaN.

In some embodiments, the present invention provides a PhC-GEMM structurewith about one (1) period, or about two (2) periods, or about three (3)periods, or about (4) periods, or about five (5) periods, or about six(6) periods, or about seven (7) periods, or about eight (8) periods, orabout nine (9) periods, or about ten (10) periods, or between about 10periods and about 15 periods, or between about 15 periods and about 20periods, or between about 20 periods and about 25 periods, or betweenabout 25 periods and about 30 periods, or between about 30 periods and40 periods, or between about 40 periods and 50 periods, or greater thanabout 50 periods.

In some embodiments, the present invention provides a PhC-GEMM structurehaving period thicknesses that are increasing in thickness with eachperiod in the direction that is moving away from the active region, andwherein the thickness of the metal material layers are eachsubstantially equal.

In some embodiments, the present invention provides a PhC-GEMM structurehaving a plurality of period thicknesses, wherein the thickness of themetal material layers and/or the thickness of the III-nitride layerseach have various magnitudes.

In some embodiments, the present invention provides a PhC-GEMM structurewith a maximum reflectivity of about 50% to about 70%, or 70% to about80%, or 80% to about 85%, or about 85% to about 90%, or about 90% toabout 91%, or about 91% to about 92%, or about 92% to about 93%, orabout 93% to about 94%, or about 94% to about 95%, or about 95% to about96%, or about 96% to about 97%, or about 97% to about 98%, or about 98%to about 99%, or greater than about 99%, for wavelengths in a rangebetween 350 nm and 600 nm.

In some embodiments, the present invention provides a PhC-GEMM structurewith a maximum reflectivity bandwidth, for reflectivity greater thanabout 80%, of about 5 nm to about 10 nm, or about 10 nm to about 15 nm,or about 15 nm to about 20 nm, or about 20 nm to about 25 nm, or about25 nm to about 30 nm, or about 30 nm to about 35 nm, or about 35 nm toabout 40 nm, or about 40 nm to about 45 nm, or about 45 nm to about 50nm, or about 50 nm to about 60 nm, or about 60 nm to about 70 nm, orabout 70 nm to about 80 nm, or about 80 nm to about 90 nm, or about 90nm to about 100 nm, for wavelengths in a range between 350 nm and 600nm.

In some embodiments, the present invention includes one or more uniquePhC-GEMM structures integrated into a single growth template. Forexample, in some embodiments, a first PhC-GEMM structure includes afirst number of periods of a first metal material having a first metalmaterial thickness and a first semiconductor material having a firstsemiconductor material thickness, and wherein the first PhC-GEMMstructure is integrated with a second PhC-GEMM structure that includes asecond number of periods of a second metal material having a secondmetal material thickness and a second semiconductor material having asecond semiconductor material thickness.

In some embodiments, the present invention includes metal materials,herein referred to as epitaxial metals, or metal-containing layers, ormetallic layers, in the metallo-semiconductor and/or metallo-dielectricstructure, device and method, wherein the metal materials include, butare not limited to, refractory metals and transition metals, including,but not limited to Hf, Zr, Ti, V, Nb, Ta, Cr, Mo, and/or W, includingcombinations of one or more or the refractory and transition metals. Inother embodiments the metal materials include, but are not limited to,the refractory metal nitrides and transition metal nitrides, including,but not limited to HfN, ZrN, TiN, VN, NbN, TaN, CrN, MoN, and/or WN,including combinations of one or more refractory metal nitrides andtransition metal nitrides. In other embodiments the metal materialsinclude, but are not limited to, the refractory-metal borides,refractory-metal diborides and transition-metal borides andtransitional-metal diborides. In some embodiments, the metal materialsinclude, but are not limited to, refractory metals and/or metalliccompounds, such as the Group IVB metals Zr, Hf, (Hf_(x)Zr_(1-x), where xis between 0 and 1, inclusive), and the transitional metal diboridesZrB2, HfB2, YB2 and (Hf_(x)Zr_(y)Y_(z)B₂ where x+y+z=1, and x and y andz are each between 0 and 1, inclusive) and the transitional metalnitrides ZrN, HfN, TiN, YZrN and (Hf_(x) Zr_(y) Y_(z) N where x+y+z=1,and x and y and z are each between 0 and 1, inclusive). In someembodiments, the metal materials include one or more of the previouslydescribed materials.

In some embodiments, the semiconductor materials include group III-groupV compound semiconductor materials including GaN, AlN, InN,Al_(x)Ga_(1-x)N (for x between 0 and 1, inclusive), In_(x)Ga_(1-x)N (forx between 0 and 1, inclusive), and/or quaternary Al_(x)In_(y)Ga_(z)N(for x+y+z=1, and x and y and z are each between 0 and 1, inclusive)materials.

In some embodiments, dielectric materials in the metallo-dielectricstructure, device and method, include, but are not limited to, metaloxides, (e.g., HfO₂, ZrO₂, ZnO, TiO₂, Nb₂O₃, Y₂O₃, Yb₂O₃, Ta₂O₅, MoO₂,and the like), conventional semiconductor dielectrics (e.g., “oxides”“nitrides”, SiO₂, GeO₂, Si₃N₄, Ga₂O₃, In₂O₃, Al₂O₃, and the like), andsilicates (e.g., HfSiO₄, ZrSiO₄, and the like).

In other embodiments, the semiconductor materials include elementalsemiconductor materials, compound semiconductor materials, tertiarysemiconductor materials, quaternary semiconductor materials, each ofwhich are well known by those having skill in the art and include, butare not limited to Si, Ge, GaAs, InAs, AlAs, AlGaAs, InGaAs, AlinGaAs,GaP, InGaP, AlGaP, AlInGaP, GaSb, ZnS, and/or the like.

In some embodiments, the plurality of alternating layers are formed orprovided on a substrate or template, wherein the substrate or templateincludes GaN-on-Si, GaN-on-Sapphire, GaN-on-SiC, SiC, GaN, ZnO, AlN,HfN, ZrN, HfB₂, ZrB₂.

In some embodiments, the above described metallo-semiconductorstructures include metal materials and semiconductor materials asdescribed previously.

In some embodiments, the plurality of alternating layers, or periods,are formed using traditional and standard epitaxial methods used in thesemiconductor arts, including, but not limited to, molecular-beamepitaxy (MBE), metal-organic chemical-vapor deposition (MOCVD),metal-organic vapor-phase epitaxy (MOVPE), hydride vapor-phase epitaxy(HVPE), physical vapor deposition (PVD), including sputtering,atomic-layer deposition (ALD), combinations thereof, and/or the like.

In some embodiments, the plurality of alternating layers, or periods, orsingle periods or single layers are formed epitaxial using cathode arcdeposition or cathode arc deposition where the beam is magneticallyturned away from the perpendicular source direction such that theoptical properties of the III-nitrides and of the refractory metalnitrides are improved. In some such embodiments, the light absorption ofIII-nitride materials is reduced and/or the reflectivity and/ortransparency of the refractory metal nitrides may be increased.

In some embodiments, the plurality of alternating layers, or periods, orsingle periods or single layers are formed epitaxial using cathode arcdeposition or cathode arc deposition where the beam is magneticallyturned away from the perpendicular source direction such that theoptical properties of the III-nitrides and of the refractory metalnitrides are improved. In some such embodiments, the light absorption ofIII-nitride materials may be reduced or the reflectivity and/ortransparency of the refractory metal nitrides may be increased. Cathodearc deposition has a higher degree of ionization than other thin filmdeposition processes resulting in materials with higher degree ofcrystallinity leading to reduced light absorption of III-nitridematerials or the higher reflectivities and/or transparency of therefractory metal nitrides.

In some embodiments, light emitting devices includes a PhC-GEMMstructure with a reflectance spectra and transmission spectra that ismatched in order that the population of emission wavelengths is dividedin order that shorter emission wavelengths overlaps a high reflectivityregion of the reflectance spectra and longer emission wavelengthsoverlap a high transmissivity region of the transmission spectra. Insome such embodiments, such a PhC-GEMM structure could be provided onboth sides of the active region or on one side of the active regionwhere on the other side a mirror is placed or any other photonicstructure is placed. As an example, in the case of a mirror on one sideand an overlapping reflectance/transmission spectra in relation to theemission wavelength being on the other side, light could resonate at theshorter wavelengths and then could escape through some slightnonuniformity in the PhC-GEMM and/or could escape through beingconverted to a slightly longer wavelength through a reabsorptionprocess. In some such embodiments, several optical processes areexploited to achieve increased efficiency devices for energy savings orincreased performance devices having higher modulation rates for higherdata rates of optical signal transfer.

In some embodiments, one or more dielectric material layers are includedwith and/or combined with the metallo-semiconductor structures describedabove to form a metallo-semiconductor-dielectric structure that isuseful for electrical and optical semiconductor devices.

In some embodiments, the metallo-semiconductor structure includes aplurality of metal layers and semiconductor layers, wherein thethickness of all of the metal layers are substantially the same and thethickness of all the semiconductor layers are substantially the same. Inother embodiments, the thicknesses of the metal layers vary according tothe requirements of the device and the thickness of the semiconductorlayers vary according to the requirements of the device.

In some embodiments, metallo-semiconductor materials, structures, anddevices are substantially transparent to selected wavelengths of opticalradiation depending on the thicknesses of the metal and semiconductorlayers to be used for transparent structures for light exiting conduitsfor generated light within light emitting devices. In some otherembodiments, metallo-semiconductor materials, structures, and devicesare made to transmit some wavelengths of light and reflect otherwavelengths of light. In some such embodiments, this is helpful fortransmitting light emitted from a diode to a phosphor for photon downconversion such that the newly emitted light from the phosphor isreflected by the metallo-semiconductor layer structure.

In some embodiments, metallo-semiconductor materials, structures, anddevices are beneficial for the subsequent epitaxial growth of alight-emitting device or electronic device, such as a transistor.

In some embodiments, the plurality of alternating layers of metal andsemiconductor materials form metallo-semiconductor devices andstructures and are used as mirrors (e.g., including highly reflectivemirrors, and semi-transparent mirrors), optical filters (e.g., includingband-pass filters, high-pass filters, and low-pass filters), sensors,photonic crystal structures, plasmonic devices, and/or the like.

In some embodiments, the material for the GEMM comprises various metalsand metal compounds which may be epitaxially grown closely latticematched to the substrate or growth template, or the buffer layer, orother layers located in the light-emitting device and having sufficientdevice quality, thereby avoiding the difficulties and reduced deviceperformance caused by high dislocation densities. In some embodiments,the GEMM materials are thermal-expansion matched to the substrate orgrowth template, or the buffer layer, or other layers located in thelight-emitting device and having sufficient device quality, therebyreducing the likelihood of cracking and dislocation densities.

In some embodiments, the epitaxial metal material layers are hereinreferred to as a grown-epitaxial metal mirror (GEMM). In someembodiments, the alternating metallo-semiconductor layers, and/or thealternating metallo-dielectric layers, and/or the alternatingmetallo-semiconductor-dielectric layers are referred to as aone-dimensional photonic-crystal GEMM (1D-PhC-GEMM) structure. In someembodiments, a single GEMM layer is patterned and etched through to forma plurality of etched-through regions and a new material having an indexof refraction that is different from the index of refraction of thesingle GEMM layer is epitaxially grown in the etched-through regions toform a two-dimensional photonic-crystal GEMM (2D-PhC-GEMM) layer. Insome embodiments, a plurality of 2D-PhC-GEMM layers is stacked on top ofone another to form a three-dimensional photonic-crystal GEMM(3D-PhC-GEMM) structure. In some embodiments, the term “PhC-GEMM” isused to describe a 1D-PhC-GEMM structure, and/or a 2D-PhC-GEMM layer,and/or a 3D-PhC-GEMM structure, and/or a combination of a 1D-PhC-GEMMstructure with a 2D-PhC-GEMM layer and/or a 3D-PhC-GEMM structure.

In some embodiments, the PhC-GEMM structure of the present invention isintegrated with conventional photonic-crystal material structures,including one-dimensional (1D) photonic crystals, two-dimensional (2D)photonic crystals, or three-dimensional (3D) photonic crystals accordingto well-known photonic crystal principles (see, e.g., PHOTONIC CRYSTALS:MOLDING THE FLOW OF LIGHT (SECOND EDITION) by John D. Joannopoulos etal., Princeton University Press; 2nd edition (Feb. 11, 2008), ISBNnumber 13:978-0691124568), which is hereby incorporated by reference inits entirety.

In some embodiments, the metallo-semiconductor layers and/or themetallo-dielectric layers and/or the metallo-semiconductor-dielectriclayers are used to form semiconductor devices, including light emittingdevices (LEDs), resonant-cavity LEDs (RC-LEDs), micro-cavity LEDs(MC-LEDs), laser diodes (LDs), vertical-cavity surface emitting lasers(VCSELs), transistors, sensors, detectors, plasmonic devices, and/or thelike.

In some embodiments, the materials, structures, and devices describedherein are used for fabricating LED-based solid state lighting (SSL)luminaires, lamps, fixtures, and the like. In some embodiments, thePhC-GEMM LEDs described herein are designed to emit blue light and areintegrated with a phosphor-doped material in order to produce whitelight. In some embodiments, a PhC-GEMM-based LED device is integratedwith a selective transmission mirror (e.g., a blue-pass mirror that istransparent to blue light). In some embodiments, a Photonic Crystal GEMMLED is coupled to a blue-pass mirror located at or near thelight-exiting face of the PhC-GEMM LED such that the blue-pass mirrorallows the blue light generated by the PhC-GEMM LED to pass through themirror to interact with and excite the phosphor-doped material togenerate white light. In some embodiments, the generated white light isreflected by the blue-pass mirror, thereby blocking the white light andpreventing its entry back into the PhC-GEMM LED. In some embodiments,the blue-pass mirror reduces heating of the die. Additional benefits ofintegrating the PhC-GEMM with the blue pass mirror are described inParkyn et al., “Remote phosphor with recycling blue-pass mirror”, Sep.8, 2005, Proceedings of SPIE, vol. 5942, which is hereby incorporated byreference in its entirety.

In some embodiments, the present invention provides photonic structuresthat include one or more periods of alternating layers of metalmaterials (e.g., HfN) and III-nitride materials (e.g., AlN) to producephotonic structures for tuning the reflectivity spectrum of the photonicstructure. In some embodiments, the peak of the reflectivity andreflectivity bandwidth spectrum is larger when HfN and GaN are used asthe alternating materials due to the larger difference in the real indexof refraction between GaN and HfN (Δn≈2.0) as compared to AlN and HfN(Δn≈1.6). In addition, HfN and GaN are substantially lattice matched andtherefore the material quality (e.g., surface roughness, full-width athalf-max (FWHM) of the x-ray diffraction (XRD) rocking-curve, and thelike) of the HfN—GaN structure will be improved as compared to a HfN—AlNstructure.

In some embodiments, the metallo-semiconductor structure is epitaxiallygrown on a GaN/sapphire to provide a highly reflective, highlyelectrically conductive PhC-GEMM structure. In some embodiments, thisstructure dramatically improves the reflectivity of the GEMM over arange of wavelengths, tunable from approximately 370 nm to approximately700 nm due to the large and continuous difference in the real index ofrefraction. In some embodiments, with proper selection of thethicknesses of the metallic layer and semiconductor layers of thePhC-GEMM structure, the reflectivity spectrum of the PhC-GEMM is tunableto select specific peak wavelengths and bandwidths and therefore addressspecific and diverse application areas.

Over the past decade, researchers and companies in the III-nitrideindustry have spent significant resources in the development ofdistributed Bragg reflectors (DBRs) with only moderate success due tothe limitations of the III-nitrides materials. For example, the mostcommon materials used for forming III-nitride-based DBRs are GaN andAl_(x)Ga_(1-x)N, and because there is a very low contrast in therefractive indexes between the GaN and AlGaN layers, a large number ofperiods and/or AlGaN layers with a high Al content is required in orderto obtain a minor with a reflectivity of only approximately 50%.However, both of these requirements increase the thermal expansioncoefficient mismatch and lattice mismatch between the GaN and AlGaNlayers resulting in the appearance of cracks on the DBR surface thatdegrades the growth and operation of the light-emitting device. Due tothese limitations, achieving DBR's with reflectivities of greater than80%, as desired by LED manufacturers, is simply not feasible usingtraditional III-nitride materials.

Whereas, in a conventional distributed Bragg reflector (DBR) is formedfrom alternating layers of semiconductor and/or dielectric materials,with each material layer having a thickness of a quarter-wavelength ofthe incident light within each material, in some embodiments, thePhC-GEMM structure includes alternating layers of metal andsemiconductor and/or dielectric materials and the thickness of the metallayers is adjusted to allow partial reflection and partial transmissionand the thickness of the semiconductor and/or dielectric layer isadjusted to be approximately a half-wavelength of the incident light. Insome embodiments, the PhC-GEMM includes metal material layers having athickness that reflects a portion of the incident light and transmits aportion of the incident light through each metal layer and semiconductormaterial layers (e.g., GaN, AlN and the like) having a thickness that isequal to approximately half of the wavelength of the incident light toproduce constructive interference of the light in the semiconductormaterial layer that is located between two of the thin metal layers in amanner similar to a Fabry-Perot cavity.

In some embodiments, the thickness of the metal layer is between about 1nm and about 5 nm, or between about 5 nm and about 10 nm, or betweenabout 10 nm and about 15 nm, or between about 15 nm and about 20 nm, orbetween about 20 nm and about 30 nm, or between about 30 nm and about 40nm, or between about 40 nm and about 50 nm, or between about 50 nm andabout 75 nm, or between about 75 nm and about 100 nm, or between about100 nm and about 150 nm, or between about 150 nm and about 200 nm. Insome embodiments, the thickness of the metal layer is preferably betweenabout 15 nm and about 45 nm.

In some embodiments, the thickness of the semiconductor layer and/or thedielectric layer is approximately half the wavelength of the incidentlight in the semiconductor layer and/or the dielectric layer when themetal layers are thin (e.g., 10 nm), as determined byt_(layer)=λ_(layer)/2=λ_(o)/2n_(layer), where n_(layer) is the index ofrefraction of the layer, n_(layer) the wavelength of the incident lightin the layer, and λ_(o) is the wavelength of the incident light invacuum. For example, the required thickness for a GaN layer (i.e.,n_(GaN)=2.39) and incident light of wavelength 450 nm (i.e., blue light)would be approximately 94 nm. In such a structure the reflectivity bandcan be quite narrow. In other embodiments, the thickness of the metalmaterial layers is increased such that the reflectivity band isbroadened and the peak wavelength is shifted. In some embodiments, toposition the peak reflectance to the wavelength of interest, thethickness of the III-nitride layer is adjusted.

In some embodiments, the PhC-GEMM structures of the present inventionprovide large tunable peak reflectivity and reflectivity bandwidths andsubstantial angle independence. In addition to tunable highreflectivity, the PhC-GEMM is also substantially lattice-matched to GaNand can also be made electrically conductive by impurity doping the GaNsuch that current injection layers are not required when the PhC-GEMM isintegrated with an optical or electrical device In some embodiments, thePhC-GEMM is grown epitaxially in a single growth system.

FIG. 1A is a block diagram of a two-layer metallo-semiconductorstructure 101, according to some embodiments of the present invention.In some embodiments, metallo-semiconductor structure 101 includessubstrate 111 (e.g., Si, GaN, sapphire, GaN-on-Sapphire, GaN-on-Si, AlN,AlN-on-sapphire, AlN-on-Si and/or the like as described above), metalmaterial layer 112 (e.g., elemental metals, composites, and/or compoundsthat include Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, and/or the like asdescribed above) on substrate 111, and III-nitride layer 113 (e.g., GaN,AlN, Si, and/or the like as describe above) on metal material layer 112.In some embodiments, III-nitride layer 113 includes impurity doping(e.g., Si doping for n-type conductivity and Mg doping for p-typeconductivity) to increase the electrical conductivity. In someembodiments, metal layer 112 and III-nitride layer 113 form a singleperiod 110 PhC-GEMM structure for tuning the reflectivity of lightincident on the structure.

In some embodiments, metallo-semiconductor structure 101 includes aplurality of periods 110 (e.g., up to 20 periods or as described above).

In some embodiments, the thickness of metal layer 112 is approximately20 nm and the thickness of III-nitride layer 113 is approximately 90 nm.In some embodiments, substrate 111 is removed following the formation ofthe metallo-semiconductor structure.

In some embodiments, metallo-semiconductor structure 101 is used as anepitaxial growth template for a semiconductor device (e.g., LED, LD,VCSEL, sensor, transistor, and the like). In other embodiments,metallo-semiconductor structure 101 is integrated with a semiconductordevice. In yet other embodiments, metallo-semiconductor structure 101 isprovided on the light exiting surface of a light-emitting device (e.g.,LED, LD, VCSEL or the like).

FIG. 1B is a block diagram of a multi-layer metallo-semiconductorstructure 102, according to some embodiments of the present invention.In some embodiments, metallo-semiconductor structure 102 issubstantially similar to metallo-semiconductor structure 101 describedabove and in FIG. 1A, except that metallo-semiconductor structure 102 iscapped with an additional metal layer 114. In some embodiments, metallayer 114 has a thickness that is substantially similar to metal layer112. In other embodiments, metal layer 114 has a thickness that is about5 nm, or between about 5 nm and about 15 nm. In yet other embodiments,metal layer 114 has a thickness that is greater than metal layer 112. Insome embodiments, metal layer 114 and metal layer 112 are formed fromthe same material. In other embodiments, metal layer 114 and metal layer112 are formed from different materials. In some embodiments,metallo-semiconductor structure 102 includes a plurality of periods 110(e.g., up to 20 periods or as described above).

FIG. 1C is a block diagram of a multi-layer metallo-semiconductorstructure 103, according to some embodiments of the present invention.In some embodiments, metallo-semiconductor structure 103 issubstantially similar to metallo-semiconductor structure 101 describedabove and in FIG. 1A, except that metallo-semiconductor structure 103includes an additional III-nitride layer 115 between substrate 111 andthe metal layer 112 of period 110. In some embodiments, III-nitridelayer 115 has a thickness that is substantially similar to III-nitridelayer 113. In other embodiments, III-nitride layer 115 has a thicknessthat is about 5 nm, or between about 5 nm and about 20 nm, or betweenabout 20 nm and about 50 nm, or between about 50 nm and about 100 nm, orbetween about 100 nm and about 500 nm, or between about 500 nm and about1,000 nm, or between about 1 μm and about 2 μm, or between about 2 μmand about 3 μm, or between about 3 μm and about 5 μm. In yet otherembodiments, III-nitride layer 115 has a thickness that is greater thanIII-nitride layer 113. In some embodiments, III-nitride layer 115 andIII-nitride layer 113 are formed from the same material. In otherembodiments, III-nitride layer 115 and III-nitride layer 113 are formedfrom different materials. In some embodiments, metallo-semiconductorstructure 103 includes a plurality of periods 110 (e.g., up to 20periods or as described above). In some embodiments, III-nitride layer115 includes impurity doping to increase the electrical conductivity.

FIG. 2A is a plot 201 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of the HfNlayer thickness, according to some embodiments of the present invention.Plot 201 illustrates the effect of HfN thickness on reflectivity for a20 period HfN—GaN metallo-semiconductor structure at a wavelength of 450nm and a fixed GaN thickness of 78 nm. The peak of the reflectivity at awavelength of 450 nm occurs at a HfN thickness of approximately 15 nmand when the HfN thickness is greater than approximately 90 nm, thereflectivity takes on the HfN bulk reflectivity value of approximately70% at 450 nm.

FIG. 2B is a plot 202 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of GaN layerthickness, according to some embodiments of the present invention. Plot202 illustrates the effect of GaN thickness on reflectivity for a 20period HfN—GaN metallo-semiconductor structure at a wavelength of 450 nmand a fixed HfN thickness of 14 nm. The peak of the reflectivity at awavelength of 450 nm occurs at GaN thicknesses that are approximatelyintegral multiples of the half wavelength of 450 nm light in GaN (e.g.,approximately 80 nm and approximately 160 nm) as shown in plot 202.

FIG. 2C is a plot 203 showing a simulated reflectivity curve for amulti-layer metallo-semiconductor structure as a function of theincident lights incident angle from normal, according to someembodiments of the present invention. Plot 203 illustrates the effect ofthe incident light's varying angle of incidence (from 0 degrees to 90degrees) on reflectivity for a 20 period HfN—GaN metallo-semiconductorstructure at a wavelength of 450 nm and for HfN having a thickness of 14nm and GaN having a thickness of 78 nm.

FIG. 2D is a plot 204 showing various simulated reflectivity curves forthree multi-layer metallo-semiconductor structures as a function of thenumber of periods in the metallo-semiconductor structure, according tosome embodiments of the present invention. Plot 204 illustrates theeffect of the number of HfN—GaN periods on the reflectivity for threedifferent HfN—GaN metallo-semiconductor structures. The reflectivity iscalculated at a wavelength of 450 nm for the three structures. For twoof the structures, the reflectivity reaches a maximum after just eight(8) periods, whereas the third structure requires over 20 periods.

FIG. 2E is a plot 205 showing simulated and actual reflectivity data fora four-period metallo-semiconductor structure (i.e., HfN/AlN) at twowavelengths (i.e., 450 nm and 530 nm), according to some embodiments ofthe present invention. Plot 205 illustrates the good agreement betweensimulated reflectivity data and actual measured data from fabricatedfour-period HfN/AlN structures. The measured reflectivity data for bulkHfN (i.e., HfN with a thickness of approximately 300 nm) is provided forcomparison.

FIG. 2F is a plot 206 showing a simulated reflectivity curve, at 530 nmwavelength, for a multi-layer metallo-semiconductor structure (i.e.,HfN/AlN) as a function of the number of periods of the HfN/AlN layerstructure, according to some embodiments of the present invention. Plot206 illustrates the effect of the number of HfN—AlN periods on thereflectivity at a wavelength of 530 nm for a HfN—AlNmetallo-semiconductor structure. For this HfN—AlN structure, thereflectivity reaches a maximum after just five (5) periods.

FIG. 2G is a plot 207 showing a plurality of measured reflectivitycurves for various multi-layer metallo-semiconductor (i.e., HfN/AlN)structures as a function of the incident wavelength of light, accordingto some embodiments of the present invention. Plot 207 illustrates theability to “tune” the reflectivity of the mirror to achieve high peakreflectivity at a desired wavelength by modifying the thickness of theHfN and AlN layers.

FIG. 2H is a plot 208 showing measured reflectivity curves for a bulkHfN mirror and a multi-layer metallo-semiconductor structure as afunction of the incident wavelength of light, according to someembodiments of the present invention. Plot 208 illustrates thecomparison between bulk HfN mirrors (i.e., a single thick HfN layerapproximately 300 nm thick) and a HfN—AlN metallo-dielectric structure(i.e., PhC-GEMM) that includes six HfN—AlN periods of 17 nm of HfNalternating with 120 nm of AlN, epitaxially grown on a GaN/Sapphire,where the GaN has a thickness of approximately 5 μm. As shown in FIG.2H, the multi-layer metallo-semiconductor structure is designed suchthat the bandwidth of the peak reflectivity is increased.

FIG. 3 is a block diagram of semiconductor device structure 301 thatincludes a multi-layer metallo-semiconductor structure (i.e., PhC-GEMM),according to some embodiments of the present invention. In someembodiments, semiconductor device structure 301 includes substrate 311(e.g., Si, GaN, sapphire, GaN-on-Sapphire, GaN-on-Si, AlN,AlN-on-sapphire, AlN-on-Si and/or the like as described above),transition layer 316 (e.g., that includes a III-nitride layer or a metalmaterial, each of which are described above) on substrate 311, metalmaterial layer 312 (e.g., elemental metals, composites, and/or compoundsthat include Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, and/or the like asdescribed above) on transition layer 316, III-nitride layer 313 (e.g.,GaN, AlN, Si, and/or the like as describe above) on metal material layer312, wherein metal material layer 312 and III-nitride layer 313 form asingle period 310 PhC-GEMM structure, metal cap layer 314 (e.g., thatincludes a metal material as described above) on PhC-GEMM period 310,III-nitride cap 331 (e.g., that includes a III-nitride material asdescribed above) on metal cap layer 314, and semiconductor devicestructure 330.

In some embodiments, transition layer 316, III-nitride layer 313, andIII-nitride cap 331 include impurity doping (e.g., Si doping for n-typeconductivity and Mg doping for p-type conductivity) to increase theelectrical conductivity.

In some embodiments, metal layer 312 and III-nitride layer 313 form asingle period 310 PhC-GEMM structure for tuning the reflectivity oflight incident on the structure. Optionally, in some embodiments,semiconductor device 301 includes a plurality of periods 310 (e.g., upto 20 periods or as described above).

In some embodiments, the thickness of metal layer 312 is approximately20 nm and the thickness of III-nitride layer 313 is approximately 90 nm.In some embodiments, substrate 311 is removed following the formation ofthe semiconductor device structure 330.

In some embodiments, semiconductor device structure 330 is an LED devicestructure and includes n-type III-nitride layer 332, active region 333located on n-type III-nitride layer 332, and p-type III-nitride layer334 located on active region 333. In some embodiments, active region 333includes one or more light emitting quantum wells (e.g., InGaN quantumwells (QWs) or multiple-quantum wells (MQW's)).

In some embodiments, transition layer 316, and/or metal cap layer 314,and/or III-nitride cap layer 331 are optional. In other embodiments, oneor more of the optional layers (i.e., transition layer 316, metal caplayer 314, and III-nitride cap layer 331) are included in semiconductordevice structure 330 as described above.

In some embodiments, substrate 311, transition layer 316, metal materiallayer 312, III-nitride layer 313, metal cap layer 314, III-nitride cap331, and semiconductor device structure 330 are each substantiallysingle crystal and substantially lattice matched to each previous andsubsequent layer.

FIG. 4A is a perspective drawing of LED 401 that includes a multi-layermetallo-semiconductor structure, according to some embodiments of thepresent invention. In some embodiments, LED 401 includes substrate 411,PhC-GEMM structure 410 on substrate 411, LED device structure 430A onPhC-GEMM structure 410, and current spreading layer 435 on LED devicestructure 430A. In some embodiments, LED device structure 430A includesn-type III-nitride layer 432A on PhC-GEMM structure 410, active region433 on n-type III-nitride layer 432A, and p-type III-nitride layer 434between active region 433 and current spreading layer 435. LED 401further includes n-contact metal 437 in electrical contact with PhC-GEMMstructure 410 and p-contact metal 436 in electrical contact with currentspreading layer 435.

In some embodiments, active region 433 includes one or more lightemitting quantum wells (e.g., InGaN quantum wells (QWs) or multiplequantum wells (MQWs)). In some embodiments, n-contact metal 437 andp-contact metal include standard metallization materials and structureswell known by those with skill in the arts.

In some embodiments, n-type III-nitride layer 432A is designed to have athickness, d1, such that d1=m*λ/n2−PD where m is an integer, n is theindex of refraction of the III-nitride, λ is the wavelength of generatedlight in the semiconductor used as a unit of measure perpendicular tothe GEMM layer, and PD is the optical penetration depth of the lightinto a GEMM layer if the thickness of the GEMM layer is greater than thepenetration depth otherwise PD is the optical length of the GEMM layer.In some embodiments, d1 is a periodic integer with integer multiples ofλ/n2 distance away from the first GEMM layer in the PhC-GEMM structure,minus the thickness of the first GEMM layer or the penetration depth ofthe light into the GEMM layer if the thickness of the first GEMM layeris greater than the penetration depth. In some such embodiments, thelight emitted by LED 401 will include optical modes 441 whose directionis parallel to the top surface of substrate 411.

In some embodiments, LED 401 includes a top surface (i.e., the planarsurface of current spreading layer 435 opposite p-type III-nitride layer434) that is flat or roughened/textured, and/or includes orderedpatterns (e.g., pyramids), non-ordered patterns, photoniclattice/crystal structures, reflective materials, metal, a DBR, and/orcombinations thereof, and/or the like.

FIG. 4B is a perspective drawing of LED 402 that includes a multi-layermetallo-semiconductor structure, according to some embodiments of thepresent invention. In some embodiments, LED 402 is substantially similarto LED 401 described above and in FIG. 4A, except that LED 402 includesLED device structure 430B on PhC-GEMM structure 410 and LED devicestructure 430B includes n-type III-nitride layer 432B on PhC-GEMMstructure 410, active region 433 on n-type III-nitride layer 432B, andp-type III-nitride layer 434 between active region 433 and currentspreading layer 435.

In some embodiments, n-type III-nitride layer 432B is designed to have athickness, d2, such that d2=m*λ/n4+λ/n8−PD where m is an integer, n isthe index of refraction of the III-nitride, λ is the wavelength ofgenerated light in the semiconductor used as a unit of measureperpendicular to the GEMM layer, and PD is the optical penetration depthof the light into a GEMM layer if the thickness of the GEMM layer isgreater than the penetration depth otherwise PD is the optical length ofthe GEMM layer. In some embodiments, d2 is periodic integer withmultiples of λ/n2 starting at λ/n8 away from the first GEMM layer minusthe thickness of the thin GEMM layer or the penetration depth of thelight into the GEMM layer if the thickness of the first GEMM layer isgreater than the penetration depth. In some such embodiments, the lightemitted by LED 402 will include optical modes 442 whose direction is ata 45 degree angle to the top surface of substrate 411.

FIG. 4C is a perspective drawing of LED 403 that includes a multi-layermetallo-semiconductor structure, according to some embodiments of thepresent invention. In some embodiments, LED 403 is substantially similarto LED 401 described above and in FIG. 4A, except that LED 403 includesLED device structure 430C on PhC-GEMM structure 410 and LED devicestructure 430C includes n-type III-nitride layer 432C on PhC-GEMMstructure 410, active region 433 on n-type III-nitride layer 432C, andp-type III-nitride layer 434 between active region 433 and currentspreading layer 435.

In some embodiments, n-type III-nitride layer 432C is designed to have athickness, d3, such that d3=m*λ/n2+λ/n4−PD where m is an integer, n isthe index of refraction of the III-nitride, λ is the wavelength ofgenerated light in the semiconductor used as a unit of measureperpendicular to the GEMM layer, and PD is the optical penetration depthof the light into a GEMM layer if the thickness of the GEMM layer isgreater than the penetration depth otherwise PD is the optical length ofthe GEMM layer. In some embodiments, d3 is periodic integer withmultiples of λ/n2 starting at λ/n4 away from the first GEMM layer minusthe thickness of the thin GEMM layer or the penetration depth of thelight into the GEMM layer if the thickness of the first GEMM layer isgreater than the penetration depth. In some such embodiments, the lightemitted by LED 403 will include optical modes 443 whose direction isperpendicular to the top surface of substrate 411.

In some embodiments, LED 401, LED 402, and LED 403 are combined with ablue-pass mirror, as described above, to prevent white light generatedby an integrated phosphor doped material from entering the LED device.

FIG. 5 is a block diagram of semiconductor device structure 501 thatincludes a multi-layer metallo-semiconductor structure (i.e., PhC-GEMMstructure 510) in combination with a thick bulk metallic layer (i.e.,top HfN layer 512C), according to some embodiments of the presentinvention. In some embodiments, semiconductor device structure 501includes substrate 511, PhC-GEMM structure 510 on substrate 511, andIII-nitride device structure 530 on PhC-GEMM structure 510. In someembodiments, PhC-GEMM structure 510 includes bottom HfN layer 512A ontop of substrate 511, period structure 509 that includes one or moreperiods of alternating layers of GaN layer 513B and HfN layer 512B onbottom HfN layer 512A (e.g., two-and-one-half periods as shown in FIG.5, such that the one or more periods begins with a GaN layer 513B andend with a GaN layer 513B), and top HfN layer 512C on period structure509.

In some embodiments, the thickness of top HfN layer 512C is selectedsuch that top HfN layer 512C is substantially transparent toperpendicular light 545 (i.e., light that is traveling in a directionthat is perpendicular to a plane defined by the top surface of the topHfN layer 512C) in order that the perpendicular light 545 interacts withand reflects from the underlying period structure 509 of the PhC-GEMMstructure 510. In some such embodiments, off-axis light 546 (i.e., lightthat is traveling in a direction that away from an axis that isperpendicular to a plane defined by the top surface of the top HfN layer512C) is substantially reflected by top HfN layer 512C such that guidedmodes are prevented from being absorbed in the underlying periodstructure 509 of the PhC-GEMM structure 510 because the path length ofoff-axis light 546 is longer than the path length of perpendicular light545.

In some embodiments, top HfN layer 512C is part of the PhC-GEMMstructure 510 and is designed to tune the optical reflectivity spectrumof the PhC-GEMM structure 510. In some embodiments, bottom HfN layer512A has a thickness such that it is non-translucent (i.e.,substantially opaque) to incident light.

FIG. 6 is a block diagram of optically pumped semiconductor devicestructure 601 that includes a plurality of multi-layermetallo-semiconductor structures (i.e., first PhC-GEMM structure 610Aand second PhC-GEMM structure 610B) in combination with a plurality ofquantum well regions (i.e., first active region 633A and second activeregion 633B), according to some embodiments of the present invention. Insome embodiments, semiconductor device structure 601 includes substrate611, epitaxial mirror 616 on substrate 611, first optical device 630A onepitaxial mirror 616, first PhC-GEMM structure 610A on first opticaldevice 630A, second optical device 630B on first PhC-GEMM structure610A, and second PhC-GEMM structure 610B on second optical device 630B.

In some embodiments, first optical device 630A further includes firstactive region 633A that includes one or more quantum wells that generateparallel light 641 and second optical device 630B further includessecond active region 633B that includes one or more quantum wells thatgenerate perpendicular light 643. In some embodiments, first PhC-GEMM610A includes one or more periods of alternating layers of HfN layer612A and GaN layer 613A (e.g., two and one-half periods as shown in FIG.6, such that both the first layer and the last layer of PhC-GEMM is HfNlayer 512A), and second PhC-GEMM 610B includes one or more periods ofalternating layers of HfN layer 512B and GaN layer 513B (e.g., fourperiods as shown in FIG. 6). In some embodiments, epitaxial mirror 616includes a single GEMM layer or a PhC-GEMM structure as describedherein.

In some embodiments, second active region 633B is electrically pumpedand is positioned at an antinode of optical cavity 620, defined by theregion between the top of first PhC-GEMM structure 610A (i.e., theinterface between first PhC-GEMM structure 610A and second opticaldevice 630B) and the bottom of second PhC-GEMM structure 610B (i.e., theinterface between second PhC-GEMM structure 610B and second opticaldevice 630B). In some embodiments, second active region 633B producesperpendicular light 643 that travels in a direction that isperpendicular to the top surface of substrate 612 such thatperpendicular light 643 impinges on first active region 633A andoptically pumps first active region 633A to produce parallel light 641.In some embodiments, perpendicular light 643 has a wavelength that isequal to or shorter than the wavelength of parallel light 641 such thatthe optical energy of perpendicular light 643 is equal to or greaterthan the energy bandgap of the one or more quantum wells in first activeregion 633A in order to efficiently optically pump the first activeregion 633A. In some embodiments, first active region 633A is positionedat a node of cavity 621.

In some embodiments, first optical device 630A is a metal clad laser, ora super-luminescent LED. In some embodiments, the second optical deviceis a light emitting diode or a vertical cavity surface emitting laser(VCSEL).

FIG. 7 is a block diagram of III-nitride substrate structure 701 thatincludes a sacrificial metallic layer, according to some embodiments ofthe present invention. In some embodiments, III-nitride substratestructure 701 includes substrate 711, sacrificial epitaxial metal layer716 on substrate 711, and III-nitride layer 722 on sacrificial epitaxialmetal layer 716. In some embodiments, III-nitride layer 722 includes GaNand is grown on sacrificial epitaxial metal layer 716 using any of theepitaxial growth techniques described above.

In some embodiments, sacrificial epitaxial metal layer 716 includes HfNand is sacrificially partially etched or fully etched, thereby leavingthe III-nitride layer 722 available for further processing. In someembodiments, partial etching of sacrificial epitaxial metal layer 716provides air gaps in sacrificial epitaxial metal layer 716 that functionas a DBR structure. In some embodiments, III-nitride layer 722 iscompletely separated and removed from substrate 711 to form afree-standing III-nitride substrate upon which optical or electricalsemiconductor devices are fabricated. In some embodiments, III-nitridelayer 722 is completely separated and removed as a step in a flip-chipprocess. In some embodiments, sacrificial epitaxial metal layer 716includes any metallic material described herein and in combination withany other metallic material described herein. In some embodiments,sacrificial epitaxial metal layer 716 includes more than one metallicmaterial layer.

FIG. 8A is a block diagram of III-nitride growth template 801 thatincludes a 2-dimensional (2D) photonic-crystal (PhC) GEMM layer (i.e.,2D-PhC-GEMM 850), according to some embodiments of the presentinvention. In some embodiments, III-nitride growth template 801 includessubstrate 811, 2D-PhC-GEMM 850 on substrate 811, and III-nitride layer822 on 2D-PhC-GEMM 850.

FIG. 8B is a perspective drawing of 2D-PhC-GEMM layer 850, according tosome embodiments of the present invention. In some embodiments,2D-PhC-GEMM layer 850 includes GEMM layer 816 and a plurality ofIII-nitride regions 852. In some embodiments, GEMM layer 810 ispatterned and etched through to form a plurality of etched-throughregions and a new material, having an index of refraction that isdifferent from the index of refraction of the GEMM layer 816, isepitaxially grown in the etched-through regions to form a plurality ofIII-nitride regions 852 to form a two-dimensional photonic-crystal GEMM(2D-PhC-GEMM layer) 850.

In some embodiments, GEMM layer 816 includes HfN and is patterned (e.g.,with holes, lines, dots, and/or various geometries and the like) andetched through. GaN is then grown into the etched through regions ofGEMM layer 816. In some embodiments, standard semiconductor processingmethods are used to pattern and etch the GEMM layer 816. In someembodiments, for example, HfN 816 is grown on a substrate 811, HfN 816is patterned and etched clear through, GaN 852 is grown in the etchthrough areas in the HfN 816, GaN 852 eventually grows thick enough andcoalesces above the HfN layer 816. In some embodiments, any metallicmaterial described herein can be used in place of and/or in combinationwith the HfN.

FIG. 8C is a perspective drawing of III-nitride growth template 803 thatincludes a 3-dimensional (3D) PhC-GEMM structure, according to someembodiments of the present invention. In some embodiments, a pluralityof 2D-PhC-GEMM layers is stacked on top of and the III-nitride regionsare offset from one another to form a three-dimensional photonic-crystalGEMM (3D-PhC-GEMM) structure. In some embodiments, III-nitride growthtemplate 803 includes substrate 811, 3D-PhC-GEMM structure 855 onsubstrate 811, and III-nitride layer 822 on 3D-PhC-GEMM structure 855.

In some embodiments, 3D-PhC-GEMM structure 855 includes a plurality ofalternating 2D-PhC-GEMM layers (e.g., 2D-PhC-GEMM layer 250A and2D-PhC-GEMM layer 250B), wherein 2D-PhC-GEMM layers 250A and 250B aresubstantially similar to 2D-PhC-GEMM layer 250 described above. However,in 3D-PhC-GEMM structure 855, the III-nitride regions 852 in 2D-PhC-GEMMlayer 250B are off-set from the III-nitride regions 852 in 2D-PhC-GEMMlayer 250A, as shown in FIG. 8C and FIG. 8D, such that the III-nitrideregions 852 in layer 250A and layer 250B do not line up.

FIG. 8D is an exploded perspective drawing 804 of III-nitride growthtemplate 803, according to some embodiments of the present invention,according to some embodiments of the present invention.

FIG. 9 is a block diagram of III-nitride tandem reflector growthtemplate 901 that includes a plurality of PhC-GEMM structures (e.g.,first PhC-GEMM structure 910A and second PhC-GEMM structure 910B),according to some embodiments of the present invention. In someembodiments, III-nitride tandem reflector growth template 901 includessubstrate 911, first PhC-GEMM template 910A on substrate 911, and secondPhC-GEMM template 910B on first PhC-GEMM template 910A. In someembodiments, first PhC-GEMM template 910A includes a plurality ofalternating layers of HfN layer 912A and GaN layer 913A, and secondPhC-GEMM template 910B includes a plurality of alternating layers of HfNlayer 912B and GaN layer 912B.

In some embodiments, first PhC-GEMM structure 910A is reflective to 450nm light but partially transparent to 460 nm light and second mirrorPhC-GEMM structure 910B is reflective to 460 nm light. In someembodiments, the reflectivity spectrum of III-nitride tandem reflectorgrowth template 901 is optimized for two wavelengths of incident light.In some embodiments, III-nitride tandem reflector growth template 901further includes three or more PhC-GEMM structures such that thereflectivity spectrum of growth template 901 is optimized for three ormore wavelengths of incident light.

FIG. 10 is a perspective drawing of vertical-cavity surface-emittinglaser (VCSEL) 1001 that includes a plurality of PhC-GEMM structures,according to some embodiments of the present invention. In someembodiments, VCSEL 1001 includes substrate 1011, n-type III-nitridelayer 1015 on substrate 1011, bottom PhC-GEMM structure 1010A on n-typeIII-nitride layer 1015, light-generating structure 1030 on bottomPhC-GEMM structure 1010A, and top PhC-GEMM structure 1010B onlight-generating structure 1030.

In some embodiments, bottom PhC-GEMM structure 1010A includes aplurality of alternating layers of metal material 1012A and III-nitridematerial 1013A and top PhC-GEMM structure 1010B includes a plurality ofalternating layers of metal material 1012B and III-nitride material1013B. In some embodiments, light-generating structure 1030 includesn-type III-nitride layer 1032, active region 1033 that include one ormore light generating quantum wells, and p-type III-nitride layer 1034.In some embodiments, VCSEL 1001 further includes side-wall insulators1057 that surrounds the side-wall of light-generating structure 1030 andtop PhC-GEMM structure 1010B, and p-type contact 1036 in electricalcontact with top PhC-GEMM structure 1010B and n-type contact 1037 inelectrical contact with n-type III-nitride layer 1015.

In some embodiments, bottom PhC-GEMM structure 1010A is designed to behighly reflective (e.g., approximately 99.9% reflective) to blue lightand top PhC-GEMM structure 1010B is designed to be partiallytransmissive (e.g., approximately 90-95% reflective) to blue light, suchthe VCSEL 1001 emits blue laser light. In some other embodiments, bottomPhC-GEMM structure 1010A is designed to be highly reflective (e.g.,approximately 99.9% reflective) to green light and top PhC-GEMMstructure 1010B is designed to be partially transmissive (e.g.,approximately 90-95% reflective) to green light, such the VCSEL 1001emits green laser light.

FIG. 11 is a block diagram of engineered light exiting surface 1101,according to some embodiments of the present invention. In someembodiments, engineered light exiting surface 1101 includes PhC-GEMMstructure 1110, n-type III-nitride layer 1132, active region 1133, andp-type III-nitride layer 1134. In some embodiments, p-type III-nitridelayer 1134 is patterned and etched using standard semiconductorfabrication techniques and equipment to form an engineered light exitingsurface. In some embodiments, engineered light exiting surface 1101increases light extraction and substantially reduces or eliminates“trapped” guided modes in a direction that is parallel to the topsurface of PhC-GEMM structure 1110. In some embodiments, engineeredlight exiting surface 1101 includes a structure as shown in FIG. 11. Insome embodiments, engineered light exiting surface 1101 increases lightextraction of emitted light 1140 due to the increased number of opticalmodes 1141 that will be within Snell's window when the emitted light1140 impinges on the light exiting surfaces 1160, 1161, 1162, and 1163.

In some embodiments, light exits from surfaces 1160, 1161, 1162, and1163. In some embodiments, exiting surfaces 1161 and 1163 have a widththat is about 0 nm. In other embodiments, exiting surfaces 1161 and 1163have a width that is greater than about 0 nm. In some embodiments, thewidth of exiting surfaces 1161 and the width of exiting surface 1163 arenot equal. In some embodiments, exiting surfaces 1110 and 1112 each forman angle θ 1117 with an axis that is perpendicular to the top surface ofPhC-GEMM structure 1110. In some embodiments, angle θ 1117 is about 0degrees, or about 5 degrees, or about 10 degrees, or about 15 degrees,or about 20 degrees, or about 25 degrees, or about 30 degrees, or about35 degrees, or about 40 degrees, or about 45 degrees, or about 50degrees, or about 55 degrees, or about 60 degrees, or about 65 degrees,or about 70 degrees, or about 75 degrees, or about 80 degrees, or about85 degrees, or about 90 degrees.

Dislocation Filter Technology

In some embodiments, the present invention includes materials,structures, and methods for improving the crystal quality of epitaxialmaterials grown on non-native substrates. For example, in someembodiments, the present invention provides a means for reducing thethreading dislocation density of AlN epitaxial material grown on silicon(Si) substrates by using a dislocation filter to essentially “filter”out the dislocations using the dislocation filter structure. In someembodiments, a reduction in dislocation density is achieved by growingalternating of layers of epitaxial metal materials (e.g., HfN and asdescribed above) and III-nitride materials (e.g., AlN and as describedabove). In some embodiments, it is believed that the material with thesmaller lattice constant (e.g., AlN) is compressing the materials withthe slightly larger lattice constant (e.g., HfN) such that dislocationsare annihilated by reacting with other dislocations.

FIG. 12 is a block diagram of III-nitride dislocation filter growthtemplate 1301, according to some embodiments of the present invention.In some embodiments, dislocation filter growth template 1301 includessubstrate 1311 (as described above), III-nitride transition layer 1372on substrate 1311, metal material base layer 1371 on III-nitridetransition layer 1372, dislocation filter 1370 on metal material baselayer 1371, and III-nitride capping layer 1314 on dislocation filter1370. In some embodiments, dislocation filter 1370 includes one or morealternating layers of metal materials 1373 (e.g., HfN, ZrN, and/or thelike as described above) and III-nitride materials 1374 (e.g., AlN, GaN,and/or the like as described above).

In some embodiments, substrate 1311 includes Si, III-nitride transitionlayer 1372 includes AlN having a thickness of between about 100 nm andabout 2 microns, metal material base layer 1371 includes HfN having athickness of about 100 nm to about 1 micron, and III-nitride cappinglayer 1314 includes AlN an/or GaN having a thickness of about 100 nm toabout 2 microns. In some embodiments, dislocation filter 1370 includesabout two (2) to about 50 alternating layers of HfN having a thicknessof about 5 nm to about 100 nm and AlN having a thickness of about 50 nmto about 500 nm.

In some embodiments, metal materials 1373 and III-nitride materials 1374are selected such that the lattice constant of the metal material 1373is greater than the lattice constant of III-nitride material 1374, inorder that the metal material 1373 includes compressive stress whengrown on III-nitride material 1374, which acts to react and annihilatedislocations and reduce the number of dislocation in subsequentalternating layers. In some embodiments, dislocation filter 1370includes any of the PhC-GEMM structures described herein. In someembodiments, dislocation filter 1370 includes metal material (ZrN) 1373and III-nitride material (GaN) 1374, or metal material (ZrN) 1373 andIII-nitride material (AlN) 1374, or metal material (HfN) 1373 andIII-nitride material (GaN) 1374, or metal material (HfN) 1373 andIII-nitride material (AlN) 1374.

In some embodiments, epitaxial device structures are provided on theIII-nitride dislocation filter growth template 1301 to formsemiconductor devices (e.g., transistors, LEDs, LDs, sensors, filters,and the like).

FIG. 13 is a cross-sectional TEM image of a portion of III-nitridedislocation filter growth template 1302, according to some embodimentsof the present invention. In some embodiments, III-nitride dislocationfilter growth template 1302 is substantially similar to III-nitridedislocation filter growth template 1301, and shows III-nitridetransition layer (AlN) 1312, metal material base layer (HfN) 1310,dislocation filter 1315 (including six periods of alternating layers ofAlN 1374 and HfN 1373), and III-nitride capping layer (AlN) 1375. As canbe clearly seen in the cross-sectional TEM image, the number ofdislocations, shown as the darker regions in the AlN layers (1312, 1374,and 1375) is steadily reduced as the number of alternating layers ofAlN—HfN increases, and the final AlN capping is nearly free ofdislocations, thereby “filtering out” the dislocations that were presentin the III-nitride transition layer 1312.

Acoustic Wave Technology

Acoustic wave technology has been utilized for decades in thedevelopment and commercialization of acoustic wave devices (e.g.,sensors and filters). Acoustic wave devices generally rely onpiezoelectric materials to generate and detect the propagation ofmechanic waves (i.e., acoustic waves) for devices operation. An overviewof acoustic wave devices and technology is provided in the referencetitled “Acoustic Wave Technology Sensors”, (Drafts, Bill, “Acoustic WaveTechnology Sensors”, IEEE TRANSACTIONS ON MICROWAVE THEORY ANDTECHNIQUES, VOL. 49, NO. 4, APRIL 2001) which is hereby incorporated byreference in its entirety.

In some embodiments, the present invention provides materials,structures, devices, and methods for acoustic wave devices andtechnology, including epitaxial and non-epitaxial piezoelectricmaterials and structures useful for acoustic wave devices (AWD)including Surface Acoustic Wave Devices, Solidly Mounted Resonators,Solidly Mounted Filters, Bulk Acoustic Wave Devices, Film Bulk AcousticResonator Devices, and the like.

In some embodiments, the acoustic wave device includes metal-cermet(i.e., a composite material composed of ceramic (cer) and metallic(met)) materials, including but not limited to all metallic-cermetmaterials described above, and more specifically(W_(Y)Mo_(1-Y))_(X)Ta_(1-X), wherein X=0 to 1, inclusive, and Y=0 to 1,inclusive, and Hf_(Z)Zr_(1-Z)N, wherein Z=0 to 1, inclusive. The cubiclattice spacing in the (111) lattice plane are W=2.87 Å, Mo=2.85 Å,Ta=3.07 Å, HfN=3.20 Å, ZrN=3.24 such that, in some embodiments, thecompositional values (i.e., X, Y, and Z) are selected such that thelattice spacings of each metal-cermet material included in themetal-cermet composite described herein is substantially lattice matchedto each other. As used herein, the term “metallic composition” refers tometallic-cermet material compositions as described above.

In some embodiments, the acoustic wave devices includespiezoelectric-dielectric-semiconductor materials, including but notlimited to all piezoelectric-dielectric-semiconductor materialsdescribed above, and more specifically to compositions including, forexample, Sc_(L)((Al_(J)Ga_((1-J)))_(K)In_((1-K)))_(1-L)N, wherein J=0 to1, inclusive, K=0 to 1, inclusive, and L=0 to 1, inclusive. The latticespacings of endpoints are AlN=3.11 Å, GaN=3.19 Å, InN=3.54 Å, andScN=3.19 Å, where AlN, GaN, and InN generally are hexagonal, althoughthey may rarely be cubic, and ScN is cubic. In some embodiments, thecompositional values (i.e., J, K, and L) are selected such that thelattice spacings of each piezoelectric-dielectric-semiconductor materialincluded in the piezoelectric-dielectric-semiconductor compositedescribed herein is substantially lattice matched to each other. In someembodiments, the lattice spacings described above are substantiallyparallel. As used herein, the term “piezo composition” refers topiezoelectric-dielectric-semiconductor material compositions asdescribed above.

In some embodiments, the present invention provides wave structures foracoustic wave devices that include combinations of two or more layers ofmetallic composition materials and/or piezo composition materials and,methods of such structures. In some such embodiments, the wavestructures include one or more metallic composition layers incombination with one or more piezo composition layers. In someembodiments, the one or more metallic composition layers and the one ormore piezo composition layers are epitaxial. In some embodiments, thethickness of each of the one or more metallic composition layers issubstantially equal and the thickness of each of the one or more piezocomposition layers is substantially equal. In other embodiments, thethickness of each of the one or more metallic composition layers isindependent and the thickness of each of the one or more piezocomposition layers is independent. In some embodiments, the wavestructure includes two or more alternating layers of metalliccomposition layers and piezo composition layers. In other embodiments,the wave structure includes one or more metallic composition layers. Inyet other embodiments, the wave structure includes one or more piezocomposition layers.

In some embodiments, the wave structure includes materials layers (e.g.,metallic composition layers and/or piezo composition layers) that arelayered upon each other such that each layer has substantially a singlephase and is substantially crystalline orientated in a singleorientation.

In some embodiments, an epitaxial wave device structure includes asubstrate, and a wave structure on the substrate. In some embodiments,the wave structure also includes a metallic composition layer on thesubstrate and a piezo composition layer on the metallic compositionlayer. In some embodiments, the epitaxial wave device structure furtherincludes an optional metallic composition layer on the piezo compositionlayer. In some embodiments, the epitaxial wave device structure isprocessed using standard semiconductor fabrication techniques to formacoustic wave devices as described in the reference titled, “AcousticWave Technology Sensors” and provided above.

In some embodiments, an epitaxial wave device structure includes asubstrate, and a wave structure on the substrate. In some embodiments,the wave structure includes a piezo composition layer on the substrate,and a metallic composition layer on the piezo composition layer. In someembodiments, the epitaxial wave device structure further includes anoptional metallic composition layer on the piezo composition layer. Insome embodiments, the epitaxial wave device structure is processed usingstandard semiconductor fabrication techniques to form acoustic wavedevices as described in the reference titled, “Acoustic Wave TechnologySensors” and provided above.

In some embodiments, the present invention provides structures havingthin layers of crystalline (and/or highly orientated crystalline grains)material, wherein the epitaxial material wave structure enables wavedevices that operate at higher frequencies and have improved deviceperformance (e.g., higher signal to noise ratios). In some embodiments,a wave structure as described above includes one or more layers ofpiezoelectric/dielectric/semiconductor material upon one or more layersof metal/cermet material and/or one or more layers of metal/cermetmaterial upon one or more layers ofpiezoelectric/dielectric/semiconductor material such that the wavestructure has a higher crystalline quality as compared to conventionalwave device structures that have a less favorable epitaxial relationshipand thereby require thicker layers to achieve the same level of crystalquality. For example, conventional wave device structures requireconverging coalescence of individually orientated crystalline grainsduring crystal growth to achieve good crystal quality and improve deviceperformance. In some embodiments, the present invention provides a wavestructure and method for achieving higher crystal alignmentsubstantially without the need for converging coalescence. In some suchembodiments, the crystalline “grains” of the epitaxial materials in thewave structure are substantially aligned. In some embodiments, the term“grains” refers to crystalline grains that are so closely aligned thatthey are substantially fully coalesced and/or converged and that two ormore “grains” may actually be considered one macro “grain”, also knownas epitaxial and/or “single crystal” and/or “highly orientatedpolycrystalline” and/or “highly orientated multi-crystalline”.

In some embodiments, the performance of acoustic wave devices isimproved when thinner Piezoelectrics/Dielectrics/Semiconductors filmsare used (e.g., high frequency performance of acoustic wave devicesimproves when thin epitaxial piezo composition layers are used). In someembodiments, the present invention provides materials that haveexcellent epitaxial relationships (e.g., are lattice matched) to enablewave devices with thin epitaxial layers to improve performance. In someembodiments, the frequency generation and response of some acoustic wavedevices are inversely proportional to the thickness of thePiezoelectrics/Dielectrics/Semiconductors materials and such frequenciescan only be reached if the crystal orientation (including polarity ofpolar films) is substantially continuous of the entire thickness of thefilm.

In some embodiments, the present invention provides monolithicintegration of thinner acoustic wave devices with various semiconductordevices, including, but not limited to electrical devices, opticaldevices, passives (e.g., resistors, capacitors, and the like),transistors, sensors, micro-electro-mechanical devices (MEMs), and thelike. In some embodiments, the acoustic wave devices, as describedherein, are combined with PhC-GEMM structure technology, as describedabove, such that the PhC-GEMM structure utilizes the piezoelectricnature of AlN, and/or GaN and/or InN.

In some embodiments, the acoustic wave structures and devices describedherein include components used for processing frequency signals such asoscillators, resonators, filters, reflectors, transmitters, and thelike.

In some embodiments, the acoustic wave structures and devices describedherein operate in the wavelength regions that include radio, microwave,infrared, visible, UV, deep UV, and x-ray.

In some embodiments, the metallic composition material and piezocomposition material, as describe herein, are also be used to improvethe performance and/or reduce the size of more “traditionally physical”devices, including but not limited to MEMs devices such as mirrorarrays, cantilevers, actuators, motors, and the like.

Metal Base Transistor Technology

In some embodiments, the present invention provides metal-basetransistor devices, structures, materials and methods of formingmetal-base transistor material structures for use in semiconductordevices. Specifically, in some embodiments, the present inventionprovides metal-base transistors that include materials and structuresthat include combinations of one or more layers of metallic materials(e.g., as described above, including but not limited to metal nitrides)and one or more layers of semiconductor materials, dielectric materials,and/or combinations of semiconductor and dielectric materials, andmethods of forming such devices, structures, and materials, wherein thesemiconductor materials and dielectric materials have been describedabove. In some embodiments, the one or more metallic layers and the oneor more semiconductor and/or dielectric layers are formed epitaxiallyand are substantially single crystal and substantially lattice matchedto each other. In other embodiments, the one or more metallic layers andthe one or more semiconductor and/or dielectric layers are depositednon-epitaxially.

In some embodiments, the present invention provides a plurality oflayers of epitaxial metal and semiconductor materials to form metal-basetransistor devices, structures, and materials and methods of formingsuch metal-base transistor devices, structures, materials, such that themetal layers and semiconductor layers are substantially lattice matched.

In some embodiments, the present invention provides a plurality oflayers of epitaxial metal, semiconductor, and dielectric materials toform epitaxial metal-base transistor devices, structures, and materialsand methods of forming such epitaxial metal-base transistor devices,structures, materials, such that the metal layers and dielectric layersare substantially lattice matched.

In some embodiments, the plurality of layers of metal and semiconductormaterials forms metal-base transistor devices and structures. In someembodiments, one or more dielectric material layers are included withand/or combined with the metal-base transistor structures describedabove to form a metal-base transistor structure that is useful forintegrating electrical and optical semiconductor devices.

In some embodiments, as used herein, the metal-base transistor is alsoreferred to as a “hot carrier transistor” and/or a “tunneling hotcarrier transistor” and/or a “hot electron transistor” and/or a“tunneling hot electron transistor”.

In some embodiments, as used herein, the metal materials used to formthe metal-base are referred to as grown-epitaxial metal mirrors (GEMMs)and a metal-base transistor that includes a GEMM metal-base is referredto as a GEMM-base transistor. In some embodiments, the present inventionincludes PhC-GEMM structures as described above. In some embodiments,the present invention provides a GEMM-base transistor and methods forfabricating a GEMM-base transistor, wherein the GEMM is a metal layer,and the GEMM-base transistor includes the following benefits:

-   -   GEMM-base transistors have base conductivities that are 1,000        times greater than conventional bipolar transistors    -   Reduced RC delay associated with charging the base-emitter        capacitance thereby increasing the Ft/Fmax of the operating        transistor    -   Reduced ionized impurity scattering because metals do not        require doping    -   GEMM layers can be made extremely thin to achieve large mean        free path carrier lengths    -   Schottky barrier height of GEMM at interfaces can be engineered        to be large    -   GEMM-base transistor device fabrication uses standard        semiconductor processes and equipment    -   Ohmic electrical contacts are readily formed with the GEMM-base        metal    -   Wafer bonding and substrate removal is not required    -   Surface depletion in a thin-base GEMM-base transistor is not a        problem compared to a base formed with semiconductor materials

Preliminary published simulations for a well designed laterally andvertically scaled GaN-based HET [Hot Electron Transistor], withAl_(x)Ga_(1-x)N emitter and Al_(y)Ga_(1-y)N collector (x>y), havedemonstrated possibilities of sub-terahertz (0.6 THz) to terahertzcutoff frequency operation, as described by Sansaptak Dasgupta in(Sansaptak, et al., “Experimental Demonstration of III-NitrideHot-Electron Transistor With GaN Base” IEEE Electron Device Letters,VOL. 32, NO. 9, 1212-1214, September 2011), which is hereby incorporatedby reference in its entirety.

In some embodiments, the present invention provides a three terminalGEMM-base transistor that includes an emitter layer, a GEMM-base layer,and a collector layer. In some embodiments, the emitter layer includes ametallic material (as described above), III-nitride materials andcompositions (doped and undoped). In some embodiments, the collectorlayer includes a metallic material (as described above), III-nitridematerials and compositions (doped and undoped). In some embodiments, theGEMM-base layer includes a metallic material, as described above (e.g.,HfN, ZrN, TiN, combinations, multiple layers, and the like). In someembodiments, the GEMM-base transistor further includes one or moreelectron or hole barrier layer. In some embodiments, the barrier layerincludes III-nitride materials and compositions (doped or undoped). Inother embodiments, the emitter layer, and/or the GEMM-base layer, and/orthe collector layer, and/or the one or more barrier layers includemagnetic materials. In yet other embodiments, the emitter layer, and/orthe GEMM-base layer, and/or the collector layer, and/or the one or morebarrier layers are superconducting. In some embodiments, the barrierlayers have a thickness that allows electrons to tunnel through thebarriers (e.g., about 1 nm to about 50 nm, or more specifically about 1nm to about 10 nm).

FIG. 14A is a block diagram of metal base transistor structure 1501.1and corresponding energy diagram 1501.2, according to some embodimentsof the present invention. In some embodiments, metal base transistorstructure 1501.1 includes substrate 1511, collector layer 1590 onsubstrate 1511, first barrier layer 1595 on collector layer 1590,GEMM-base layer 1591 on first barrier layer 1595, second barrier layer1596 on GEMM-base layer 1591, and emitter layer 1592 on second barrierlayer 1596. In some embodiments, collector layer 1590 includes n-GaN,first barrier layer 1595 includes n-AlGaN, GEMM-base layer 1591 includesHfN, second barrier layer 1596 includes n-AlGaN, and emitter layer 1592includes n-GaN.

In some embodiments, energy diagram 1501.2 shows the electron conductionband 1599 and the ability of an electron 99 to tunnel through 1598and/or over, via thermionic emission 1597, second barrier 1596.

In some embodiments, first barrier layer 1595 and second barrier layer1596 are not included such that collector layer 1590 and emitter layer1592 form Schottky contacts with GEMM-base layer 1591.

FIG. 14B is a block diagram of metal base transistor structure 1502.1and corresponding energy diagram 1502.2, according to some embodimentsof the present invention. In some embodiments, metal base transistorstructure 1502.1 is substantially similar to metal base transistorstructure 1501.1, except that metal base transistor structure 1502.1does not include a first barrier layer, and therefore, collector layer1590 is in direct contact and forms a Schottky contact 1588 withGEMM-base layer 1591. In some embodiments, energy diagram 1502.2 showsthe electron conduction band 1599 and the ability of an electron 99 totunnel through 1598 and/or over, via thermionic emission 1597, secondbarrier 1596.

FIG. 14C is a block diagram of metal base transistor structure 1503.1and corresponding energy diagram 1503.2, according to some embodimentsof the present invention. In some embodiments, metal base transistorstructure 1503.1 is substantially similar to metal base transistorstructure 1501.1, except that metal base transistor structure 1503.1does not include either a first barrier layer or a second barrier layer,and therefore, collector layer 1590 is in direct contact and forms aSchottky contact 1588 with GEMM-base layer 1591 and emitter layer 1592is in direct contact and forms a Schottky contact 1588 with GEMM-baselayer 1591. In some embodiments, energy diagram 1503.2 shows theelectron conduction band 1599 and the ability of an electron 99 totunnel through 1598 and/or over, via thermionic emission 1597, secondbarrier 1596.

FIG. 14D is a block diagram of metal base transistor structure 1504.1and corresponding energy diagram 1504.2, according to some embodimentsof the present invention. In some embodiments, metal base transistorstructure 1504.1 is substantially similar to metal base transistorstructure 1502.1, except that metal base transistor structure 1504.1further includes a resonance cavity 1585 placed in the middle of secondbarrier layer 1596 in order to induce resonant tunneling of electrons1598. In some embodiments, energy diagram 1502.2 shows the electronconduction band 1599 and the ability of an electron 99 to resonantlytunnel through 1598 and/or over, via thermionic emission 1597, splitsecond barrier 1596.

It is specifically contemplated that the present invention includesembodiments having combinations and subcombinations of the variousembodiments and features that are individually described herein (i.e.,rather than listing every combinatorial of the elements, thisspecification includes descriptions of representative embodiments andcontemplates embodiments that include some of the features from oneembodiment combined with some of the features of another embodiment).Further, some embodiments include fewer than all the componentsdescribed as part of any one of the embodiments described herein. Stillfurther, it is specifically contemplated that the present inventionincludes embodiments having combinations and subcombinations of thevarious embodiments described herein and the various embodimentsdescribed by the related applications incorporated by reference inparagraph [0002] of the present application.

It is to be understood that the above description is intended to beillustrative, and not restrictive. Although numerous characteristics andadvantages of various embodiments as described herein have been setforth in the foregoing description, together with details of thestructure and function of various embodiments, many other embodimentsand changes to details will be apparent to those of skill in the artupon reviewing the above description. The scope of the invention shouldbe, therefore, determined with reference to the appended claims, alongwith the full scope of equivalents to which such claims are entitled. Inthe appended claims, the terms “including” and “in which” are used asthe plain-English equivalents of the respective terms “comprising” and“wherein,” respectively. Moreover, the terms “first,” “second,” and“third,” etc., are used merely as labels, and are not intended to imposenumerical requirements on their objects.

What is claimed is:
 1. An optical-electrical device having a firstlayered structure, wherein the first layered structure has areflectivity at a wavelength of light used in the device, the firstlayered structure comprising: a substrate having a top surface and abottom surface; and a plurality of periods of a metallo-semiconductor onthe top surface of the substrate, wherein each of the plurality ofperiods includes a first layer and a second layer, wherein the firstlayer is a metal material having a thickness and characterized by anoptical penetration depth, and the second layer is a semiconductorhaving a thickness d1, and wherein the first layer is substantiallylattice matched to the second layer.
 2. The device of claim 1, whereinthe metal material includes HfN and the semiconductor includes GaN. 3.The device of claim 1, wherein the metal material includes ZrN and thesemiconductor includes GaN.
 4. The device of claim 1, wherein the metalmaterial includes HfN and the semiconductor includes AlN.
 5. The deviceof claim 1, wherein the metal material includes ZrN and thesemiconductor includes AlN.
 6. The device of claim 1, wherein the metalmaterial includes Hf and the semiconductor includes a III-nitridematerial.
 7. The device of claim 1, wherein d1=m*λ/n2−PD, where m is aninteger, n is an index of refraction of the semiconductor, λ is thewavelength of the light in the semiconductor, and PD is the opticalpenetration depth of the light into the metal material if the thicknessof the first layer is greater than the optical penetration depth andotherwise PD is an optical length of the thickness of the first layer.8. The device of claim 1, wherein the optical-electrical device furtherincludes: a metal-cap layer on the metallo-semiconductor structure,wherein the metal-cap layer includes a metal material; a III-nitride caplayer on metal-cap layer, wherein the III-nitride cap layer includes atleast one of the group consisting of AlN and GaN; and a semiconductordevice on the III-nitride cap layer, wherein the semiconductor deviceincludes a layer of N-type III-nitride material, a layer of P-typeIII-nitride material, and an active layer located between the layer ofN-type III-nitride material and the layer of P-type III-nitridematerial, and wherein the active layer includes a plurality of quantumwells.
 9. The device of claim 1, wherein the optical-electrical devicefurther includes: a semiconductor device on the firstmetallo-semiconductor structure, wherein the semiconductor deviceincludes a layer of N-type III-nitride material, a layer of P-typeIII-nitride material, and an active layer located between the layer ofN-type III-nitride material and the layer of P-type III-nitridematerial, wherein the active layer includes a plurality of quantumwells; and a second metallo-semiconductor structure on the semiconductordevice, wherein the second metallo-semiconductor structure includes aplurality of metallo-semiconductor periods, and wherein the active layeris positioned at an antinode of an optical cavity formed by the firstand second metallo-semiconductor structures.
 10. The device of claim 1,and wherein the optical-electrical device further includes: a secondmetallo-semiconductor structure on the first metallo-semiconductorstructure, wherein the second metallo-semiconductor structure includes aplurality of metallo-semiconductor periods, and wherein the firstmetallo-semiconductor structure is reflective to 450-nm-wavelength lightand partially transparent to 460-nm-wavelength light, and wherein thesecond metallo-semiconductor structures is reflective to460-nm-wavelength light.
 11. A method for making an optical-electricaldevice having a first layered structure, wherein the structure has areflectivity at a wavelength of light used in the device, the structurecomprising: providing a substrate having a top surface and a bottomsurface; and forming a plurality of metallo-semiconductor periods on thetop surface of the substrate, wherein each of the plurality of periodsincludes a first layer and a second layer, wherein the first layer is ametal material having a thickness and characterized by an opticalpenetration depth, and the second layer is a semiconductor having athickness d1, wherein d1=m*λ/n2−PD, where m is an integer, n is an indexof refraction of the semiconductor, λ is the wavelength of the light inthe semiconductor, and PD is the optical penetration depth of the lightinto the metal material if the thickness of the first layer is greaterthan the optical penetration depth and otherwise PD is an optical lengthof the thickness of the first layer, and wherein the first layer issubstantially lattice matched to the second layer. III-nitride
 12. Themethod of claim 11, wherein the method further includes: forming ametal-cap layer on the layered structure, wherein the metal-cap layerincludes a metal material; forming a III-nitride cap layer on metal-caplayer, wherein the III-nitride cap layer includes at least one of thegroup consisting of AlN and GaN; and forming a semiconductor device onthe III-nitride cap layer, wherein the semiconductor device includes alayer of N-type III-nitride material, a layer of P-type III-nitridematerial, and an active layer located between the layer of N-typeIII-nitride material and the layer of P-type III-nitride material, andwherein the active layer includes a plurality of quantum wells.
 13. Themethod of claim 11, and wherein the method further includes: forming asemiconductor device on the first layered structure, wherein thesemiconductor device includes a layer of N-type III-nitride material, alayer of P-type III-nitride material, and an active layer locatedbetween the layer of N-type III-nitride material and the layer of P-typeIII-nitride material, wherein the active layer includes a plurality ofquantum wells; and forming a second metallo-semiconductor structure onthe semiconductor device, wherein the second metallo-semiconductorstructure includes a plurality of metallo-semiconductor periods, andwherein the active layer is positioned at an antinode of an opticalcavity formed by the first layered and the second metallo-semiconductorstructures.
 14. The method of claim 11, and wherein the method furtherincludes: forming a second metallo-semiconductor structure on the firstlayered structure, wherein the second metallo-semiconductor structureincludes a plurality of metallo-semiconductor periods, and wherein theplurality of metallo-semiconductor periods of the first layeredstructure is reflective to 450-nm-wavelength light and partiallytransparent to 460-nm-wavelength light, and wherein the secondmetallo-semiconductor structures is reflective to 460-nm-wavelengthlight.
 15. An optical-electrical device having a first layeredstructure, wherein the first layered structure has a reflectivity at awavelength of light used in the device, the structure comprising: asubstrate having a top surface and a bottom surface; and a plurality ofmetallo-dielectric periods on the top surface of the substrate, whereineach of the plurality of periods includes a first layer and a secondlayer, wherein the first layer is a metal material having a thicknessand characterized by an optical penetration depth, and the second layeris a dielectric having a thickness d, and wherein the first layer issubstantially lattice matched to the second layer.
 16. The device ofclaim 15, wherein the dielectric is a semiconductor dielectric.
 17. Thedevice of claim 15, wherein the dielectric includes aluminum nitride.